AMD appears poised to introduce its 3D V-Cache technology to the professional desktop market. A recent shipping manifest has unveiled the Ryzen 9 Pro 9965X3D, a 16-core CPU with a 170W TDP.
Hardware enthusiast @Olrak29_ initially discovered this information, which was then reported by VideoCardz. The processor is listed with product ID 100-000001999. The manifest indicates a 16-core, 32-thread chip with a 170W TDP. This TDP is significant because it matches the Ryzen 9 9950X3D, unlike the lower-power SKUs often seen in the Pro series. The “9965” designation aligns with AMD’s practice of using slightly elevated model numbers for professional chips to differentiate them from consumer versions, while still utilizing the Zen 5 architecture.
The processor’s database entry shows it is in the Design Validation Testing (DVT) phase. This indicates that the silicon has progressed beyond the initial Engineering Validation (EVT) stage and is now undergoing stability and compatibility tests to ensure reliability. DVT is a late development phase, but it comes before the final Production Process Validation (PVT). This suggests a launch is probable, though the official release might still be several months in the future.
A Pro X3D chip’s main advantage combines a large L3 cache with essential business security features. Although the manifest does not specify the cache size, it is expected to have 144 MB of L3 cache, similar to the consumer 9950X3D. This extensive cache could significantly boost performance in latency-sensitive professional applications. Furthermore, the “Pro” label confirms the integration of the AMD Pro Security suite, which includes Secure Processor, Shadow Stack, Microsoft Pluton Security, Memory Guard, and Platform Secure Boot.
