Browsing: Hardware

Levelplay, a new company that debuted its cooling line at Computex 2024, introduces the Combat Liquid 360 HUD AIO CPU cooler. This 360mm radiator-equipped cooler features RGB fans and an integrated LCD screen, providing real-time system information.

Corsair has introduced two limited-edition models to its FRAME 4000D lineup: the Vault Series Nova and Galaxy cases. These new chassis feature unique color-shifting finishes, with Nova transitioning from blue to purple and Galaxy from pink to grey, offering extensive customization and an upgraded front I/O panel.

Sapphire has introduced its new Pure X870A WiFi 7 motherboard, an all-white AM5 option designed for high-end gaming PCs. Featuring the full X870 chipset and a minimalist aesthetic, this board supports the latest Ryzen CPUs and advanced connectivity.

Tryx introduces the Flova F50, an ATX mid-tower chassis that stands out with its fabric-covered front panel and an innovative cross-flow radial fan for cooling. Available in black, white, and pink, this case offers a premium aesthetic and robust hardware compatibility starting at £130.

The Creality K2 Pro Combo 3D printer represents significant advancements in consumer 3D printing technology. This model features high-speed printing, an actively heated and enclosed print chamber, and a hot end capable of reaching 300°C for various filament types. Priced around $1050, it has received high praise for its quality.

This report details the essential hardware requirements for Lumion, a real-time visualization tool utilizing high-performance rasterization and ray tracing. It provides data-driven insights into GPU, CPU, and memory specifications needed for stable frame rates and efficient 4K ray-traced exports, focusing on the latest 2026-tier hardware and the critical role of VRAM.

AMD’s upcoming “Olympic Ridge” Ryzen desktop processors, featuring Zen 6 cores and TSMC’s 2nm process, are anticipated to significantly increase core counts. Reports suggest configurations ranging from 6 to 12 cores for single-CCD models and up to 24 cores for dual-CCD variants, alongside enhanced L3 cache and continued AM5 socket support.

Leaked information suggests Intel’s upcoming 900-series “Nova Point” chipsets, designed for the late 2026 “Nova Lake-S” processors, will introduce the LGA 1954 socket and a more segmented lineup. Details reveal five PCH variants, including the flagship Z990 with BCLK overclocking and PCIe 5.0 lanes, and the Z970 for mainstream enthusiasts, alongside the B960, W980, and Q970.